ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17
ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17
ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17
ECCOBOND 2332-17 is a solventless epoxy adhesive that
develops high bond strength when cured at temperatures as
low as 100 to 130°C. It combines flexibility at low temperatures
plus high peel and tensile shear strength over a broad
temperature range.
本公司專(zhuān)業(yè)提供電子膠黏劑、樂(lè)泰 樂(lè)泰膠等產(chǎn)品服務(wù)和相關(guān)技術(shù)咨詢(xún),歡迎廣大新老朋友就電子膠黏劑、樂(lè)泰 樂(lè)泰膠等方面的問(wèn)題與我們溝通交流。
技術(shù)服務(wù)熱線:021-51693135 |